NLM has signed an exclusive license for several key Electro-Optic (EO) materials patents from the University of Washington. As described in peer-reviewed articles in Science and Nature, a new combination of materials and techniques has enabled the latest EO materials to be integrated into a chip.

The result of 20 years of research and over $20 million in R&D funding, the new EO materials and integration techniques were developed in the world-renowned University of Washington Dalton-Robinson Labs.